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Used - Acceptable. Worn cover. Ex-library with wear - may contain significant amounts of highlighting and underlining in pen or pencil. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.

Like New condition. Great condition, but not exactly fully crisp. The book may have been opened and read, but there are no defects to the book, jacket or pages. 0.62

This book is arguably the first one focusing on packaging material testing and quality assurance. Food Packaging Materials: Testing & Quality Assurance provides information to help food scientists, polymer chemists, and packaging technologists find practical solutions to packaging defects and to develop innovative packaging materials for food products. Knowledge of packaging material testing procedures is extremely useful in the development of new packaging materials. Unique among books on packaging, this reference focuses on basic and practical approaches for testing packaging materials. A variety of packaging materials and technologies are being used, with glass, paper, metal, and plastics as the most important groups of materials. Material properties such as mechanical and other physical properties, permeability, sealing, and migration of substances upon food contact are determining factors for food quality, shelf life, and food safety. Therefore, food packaging materials have to be tested to ensure that they have correct properties in terms of permeability for gases, water vapor, and contaminants; of mechanical and other physical properties; and of the thickness of main components and coating layers. This book has been designed to shed light on food packaging material testing in view of packaging integrity, shelf life of products, and conformity with current regulations. This comprehensive book, written by a team of specialists in the specific areas of food packaging, package testing, and food contact regulations, deals with the problems in a series of well-defined chapters. It covers the relations between packaging properties and shelf life of products and describes testing methods for plastics, metal, glass, and paper, including the areas of vibration, permeation, and migration tests. It will be of benefit for students, scientists, and professionals in the area of food packaging.

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

The ultimate, up-to-the-minute electronic packaging resource The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need! For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details design tradeoff considerations, and presents specific system-level solutions. This unprecedented and unsurpassed multi-disciplinary coverage not only includes all the new technologies--BGA, Flip Chip, DCA, and CSP--it shows how they can be most effectively integrated. With its clear explication of both theoretical and practical issues, Electronic Packaging will be of considerable and continuing value if you hope to design and/or refine more reliable, robust, and cost-effective packaging solutions for virtually any interconnect system.

The ultimate, up-to-the-minute electronic packaging resource The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need! For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details design tradeoff considerations, and presents specific system-level solutions. This unprecedented and unsurpassed multi-disciplinary coverage not only includes all the new technologies--BGA, Flip Chip, DCA, and CSP--it shows how they can be most effectively integrated. With its clear explication of both theoretical and practical issues, Electronic Packaging will be of considerable and continuing value if you hope to design and/or refine more reliable, robust, and cost-effective packaging solutions for virtually any interconnect system.

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Packaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals.Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging.With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals.Provides the ideal introduction and reference for both students and experienced packaging professionalsExamines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issuesReviews the principal packaging materials such as glass, metal, plastics, paper and paper board

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

In the Third Edition of Taylor v. Pinnacle Packaging Products, Inc., the plaintiff, Jamie Taylor, was hired by the defendant, Pinnacle Packaging Products, Inc., to work in the company warehouse. During her employment, the plaintiff claims she was sexually harassed by the warehouse manager, John Hamilton. Taylor was fired by Hamilton during her probation period. The plaintiff alleges that she was fired because she resisted the advances of Hamilton. Taylor has sued Pinnacle under a Title VII claim for sexual harassment and wrongful discharge. There are three witnesses for the plaintiff and four for the defendant. A deposition version of Taylor v. Pinnacle Packaging Products, Inc. is also available in plaintiff, defendant, and faculty versions. The deposition and trial files are fully integrated, so that students may use the deposition materials to study deposition practice and then go on to study trial practice using the trial materials. Full color copies of exhibits are available digitally.

Commercial-grade packaging tape is a great choice for your most critical packaging tape needs. Made from recycled materials, this tape has the same trusted performance of Scotch 3750 Commercial-grade Packaging Tape. Strong hot-melt adhesive and backing

Commercial-grade packaging tape is a great choice for your most critical packaging tape needs. Made from recycled materials, this tape has the same trusted performance of Scotch 3750 Commercial-grade Packaging Tape. Strong hot-melt adhesive and backing seal out moisture, dust and dirt to provide excellent holding power for heavy-duty packaging and shipping. Tape resists splitting and assures reliable closures. This time-proven construction assures superior performance in many environments. Tape meets U.S. Postal Regulations for standard packages.

Explores new and innovative materials designed to change the way consumers experience product packaging The third in a series of ten volumes exploring the constantly evolving frontiers of design, Material Innovation: Packaging Design presents products whose packaging reaches new heights of innovation. The range is diverse and international, from “plantable” packaging that can be buried in dirt after consumer use, later to emerge as a plant to alcohol bottles with labels that react to music, and bespoke, collectible jars of Marmite XO.Material Innovation: Packaging Design explores not only the latest advances in consumer product packaging but also how such advances could fail or flourish within the increasingly digital landscape of the twenty-first century. Case studies featured throughout the book profile the innovative use of materials by a particular practitioner, practice, or company, offering specific and elegant solutions. Clearly structured and illustrated throughout, this book will connect reader (whether student or professional) to material. 350+ illustrations

VEVOR Packaging Strapping Roll. This strap roll is extra thick and strong, designed for heavy-duty packing and shipping. It stands up to long-term pressure without losing its shape, ensuring your goods stay secure. Compatible with most packing tools, it makes packing easy and efficient. Color: White. Material: Fiber.

Select PCB materials for top performing boards From weaving glass fiber mats to testing finished boards, this one-stop materials database offers the first close-up look at how to process and fabricate world-class PCBs. Printed Circuit Board Materials Handbook gives you a complete, hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials - plus the expertise to transform them into a high-performance printed circuit card. Packed with over 400 how-to illustrations, this encyclopedia tool gives you the know-how to: Master the processes for glass fiber reinforcement, polyimide film, PET, PEN, and resins Work with copper foils, anodes, prepreg and laminates, aramid mats, and drill bits and routers Fabricate rigid and flexible printed wiring boards Apply the latest coating, laminating, etching, and electroplating methods Maximize techniques for hot air leveling, microsection analysis and electrical test Resolve controversial cleaning issues and CFC problems plus conduct troublshooting and failure analysis Much more

Select PCB materials for top performing boards From weaving glass fiber mats to testing finished boards, this one-stop materials database offers the first close-up look at how to process and fabricate world-class PCBs. Printed Circuit Board Materials Handbook gives you a complete, hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials - plus the expertise to transform them into a high-performance printed circuit card. Packed with over 400 how-to illustrations, this encyclopedia tool gives you the know-how to: Master the processes for glass fiber reinforcement, polyimide film, PET, PEN, and resins Work with copper foils, anodes, prepreg and laminates, aramid mats, and drill bits and routers Fabricate rigid and flexible printed wiring boards Apply the latest coating, laminating, etching, and electroplating methods Maximize techniques for hot air leveling, microsection analysis and electrical test Resolve controversial cleaning issues and CFC problems plus conduct troublshooting and failure analysis Much more

In the Third Edition of Taylor v. Pinnacle Packaging Products, Inc., the plaintiff, Jamie Taylor, was hired by the defendant, Pinnacle Packaging Products, Inc., to work in the company warehouse. During her employment, the plaintiff claims she was sexually harassed by the warehouse manager, John Hamilton. Taylor was fired by Hamilton during her probation period. The plaintiff alleges that she was fired because she resisted the advances of Hamilton. Taylor has sued Pinnacle under a Title VII claim for sexual harassment and wrongful discharge. There are three witnesses for the plaintiff and four for the defendant. A deposition version of Taylor v. Pinnacle Packaging Products, Inc. is also available in plaintiff, defendant, and faculty versions. The deposition and trial files are fully integrated, so that students may use the deposition materials to study deposition practice and then go on to study trial practice using the trial materials. Full color copies of exhibits are available digitally.

In the Third Edition of Taylor v. Pinnacle Packaging Products, Inc., the plaintiff, Jamie Taylor, was hired by the defendant, Pinnacle Packaging Products, Inc., to work in the company warehouse. During her employment, the plaintiff claims she was sexually harassed by the warehouse manager, John Hamilton. Taylor was fired by Hamilton during her probation period. The plaintiff alleges that she was fired because she resisted the advances of Hamilton. Taylor has sued Pinnacle under a Title VII claim for sexual harassment and wrongful discharge. There are three witnesses for the plaintiff and four for the defendant. A deposition version of Taylor v. Pinnacle Packaging Products, Inc. is also available in plaintiff, defendant, and faculty versions. The deposition and trial files are fully integrated, so that students may use the deposition materials to study deposition practice and then go on to study trial practice using the trial materials. Full color copies of exhibits are available digitally.